HUAWEI''S ASCEND AI CHIP ECOSYSTEM SCALES UP AS CHINA

AI Chip Components for Servers

AI Chip Components for Servers

Coverage across current and emerging chip types, including GPUs, CPUs, custom AI ASICs, and other AI chips, from over 40 chip designers, historic market data from 2022-2024, and market forecasts from 2025 to 2035. AI model training and inference workloads are forcing the industry to rethink not only how much compute fits in a rack, but how servers are architected from end to end — transforming computing infrastructure as we know it. 2 Hyperscalers are spending $380B+ on AI capex in 2025 while simultaneously building custom chips (TPU, Trainium, Maia, MTIA) that offer 40-65% TCO advantages over GPUs. 3 Broadcom and Marvell control ~95% of the custom ASIC co-design market — Google alone spends ~$8B/year with Broadcom on TPU. Within this hardware ecosystem, printed circuit boards (PCBs) play a critical role as the structural foundation for electronic components and the provider of electrical. Our new AI Chip Components explorer tracks how much advanced-node logic, memory, and advanced packaging capacity is consumed by leading AI chip designers. Artificial intelligence (AI) is being adopted across all industry sectors and the growing need to run AI (as well as machine learning, or ML) workloads is placing considerable demands on servers.

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Trends in the Optical Fiber and Cable Industry between China and Europe

Trends in the Optical Fiber and Cable Industry between China and Europe

The rapid advancement of high-speed communication networks is driving widespread fiber deployment, rising data traffic from cloud computing and video streaming is boosting demand for optical connectivity, growing adoption of fiber in smart city and IoT infrastructure is. fiber optics cable by Application (Long-Distance Communication, FTTx, Local Mobile Metro Network, CATV, Others), by Types (Multi-Mode Fiber Optics Cable, Single-Mode Fiber Optics Cable), by North America (United States, Canada, Mexico), by South America (Brazil, Argentina, Rest of South America). Market Size by Fiber Type, by Deployment, by Cable Type, by End Use Industry – Global Forecast. The global fiber optic cable market was valued at USD 13 billion in 2024 and is estimated to grow at a CAGR of 10. The Fiber Optic Cable Market Report is Segmented by Cable Type (Armored Cable, Non-Armored Cable, and More), Fiber Mode (Single-Mode Fiber, Multi-Mode Fiber, and More), Installation Type (Aerial/Overhead, Underground/Buried, and More), End-User Industry (Telecommunication, Power Utilities and Smart.

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China Unicom Optical Cable Laying Construction

China Unicom Optical Cable Laying Construction

China Unicom Group, one of China's major telecommunications operators, has revealed plans for the construction of a nearly 3,000-kilometer-long submarine optical fiber cable, which will span from Hong Kong to Sihanoukville in southern Cambodia. The proposed EMA (Europe-Middle East-Asia) cable would connect Hong Kong to China's island. It accelerates the construction of network infrastructure and actively plans computing power , enhanced the breadth and depth of mobile network coverage and user perception. An image taken on May 10 shows a vessel laying submarine cables off Lingshui, Hainan province, to support the building of China Unicom's international submarine cable landing station.

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Is co-packaged optics a type of optical chip

Is co-packaged optics a type of optical chip

CPO, or "Co-Packaged Optics," is an advanced opto-electronic co-packaging technology. It involves co-packaging the optical engine (including lasers, modulators, and other optical components) and a high-performance electrical chip (such as a switch ASIC) on the same substrate. Advanced packaging technologies, such as 3D chiplets hetero-integration and co-packaged optics (CPO), have become crucial for further improving system performance. Currently, most solutions rely on silicon-based technologies, which alleviate some challenges but still face issues such as warpage. The optical links of the future must not only address growing bandwidth requirements but also adhere to constraints related to power consumption, cost, space.

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