Grinding Method for Distribution Box Cover Plates
Grinding should commence with the finest grit size that will establish an initially flat surface and remove the effects of sectioning within a few minutes. Table I list the most common type of abrasive blades used for metallographic sectioning and Table II lists cutting parameters for diamond wafer cutting. Diamond Wafer Blade Selection Guidelines Mounting - The mounting operation accomplishes three important functions (1) it protects the.
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