SOUTHEAST ASIA''S CHIP RACE PROSPECTS AND PERILS

Upstream chip companies for optical modules

Upstream chip companies for optical modules

Key upstream optical chip companies include Yunjie Technology, a top-six global optical chip manufacturer and leading domestic IDM for high-speed chips. Its 10G DFB chip has the highest global market share, while CW lasers rank second worldwide. The rapid development of AIGC has promoted the demand for 800G optical modules, and the entire industrial chain involving optical components, optical modules, and optical communication equipment is expected to fully benefit. Over the past year, the most active sector in A-shares has been AI, with optical modules emerging as the leading sub-sector.

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AI Chip Components for Servers

AI Chip Components for Servers

Coverage across current and emerging chip types, including GPUs, CPUs, custom AI ASICs, and other AI chips, from over 40 chip designers, historic market data from 2022-2024, and market forecasts from 2025 to 2035. AI model training and inference workloads are forcing the industry to rethink not only how much compute fits in a rack, but how servers are architected from end to end — transforming computing infrastructure as we know it. 2 Hyperscalers are spending $380B+ on AI capex in 2025 while simultaneously building custom chips (TPU, Trainium, Maia, MTIA) that offer 40-65% TCO advantages over GPUs. 3 Broadcom and Marvell control ~95% of the custom ASIC co-design market — Google alone spends ~$8B/year with Broadcom on TPU. Within this hardware ecosystem, printed circuit boards (PCBs) play a critical role as the structural foundation for electronic components and the provider of electrical. Our new AI Chip Components explorer tracks how much advanced-node logic, memory, and advanced packaging capacity is consumed by leading AI chip designers. Artificial intelligence (AI) is being adopted across all industry sectors and the growing need to run AI (as well as machine learning, or ML) workloads is placing considerable demands on servers.

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Driver chip for optical module

Driver chip for optical module

The driver chip is an electronic integrated circuit that delivers precise electrical signals to the laser transmitter chip (e. Build high-performance and power-efficient optical modules for wireless, data center and communication applications with our optical networking ICs. MACOM is pleased to announce production availability of our MACOM PURE DRIVE TIAs and Laser Drivers supporting LPO architectures. These high-performance parts have been leveraged in leading module and system level designs and enable highly efficient interconnect spanning both short reach and long.

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KVM switcher chip DVI

KVM switcher chip DVI

Um mehrere PC‑Systeme mit nur einer Maus und einer Tastatur zu bedienen, wird ein KVM‑Switch benötigt. Beim DVI‑KVM‑Switch wird der Monitor über die DVI‑Schnittstelle angeschlossen. Wichtig ist beim Kauf auf die richtigen Eingänge für die Hardware sowie die Kabelführung. DVI-I DVI-Aüberträgt analoge Signale und wird häufig in Verbindung eines passiven VGA‑zu‑DVI‑Adapters benutzt, um ein analoges VGA-Signal an einen DVI-I Anschluss zu schicken. Denn gerade Geräte mit USB-Anschluss-Ports im unteren Preissegment nötigen den umgeschalteten PC dazu, die Maus und die Tastatur neu zu erkennen, was zu kleinen Aussetzern bei der Arbeit führt.

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Is co-packaged optics a type of optical chip

Is co-packaged optics a type of optical chip

CPO, or "Co-Packaged Optics," is an advanced opto-electronic co-packaging technology. It involves co-packaging the optical engine (including lasers, modulators, and other optical components) and a high-performance electrical chip (such as a switch ASIC) on the same substrate. Advanced packaging technologies, such as 3D chiplets hetero-integration and co-packaged optics (CPO), have become crucial for further improving system performance. Currently, most solutions rely on silicon-based technologies, which alleviate some challenges but still face issues such as warpage. The optical links of the future must not only address growing bandwidth requirements but also adhere to constraints related to power consumption, cost, space.

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