High-efficiency and high-brightness broad area laser diodes with buried

Buried-regrown-implant-structure (BRIS) technology combines two-step epitaxial regrowth with an intermediate ion implantation step in order to realise a buried current aperture close to the active

Buried-regrown-implant-structure diode lasers with ultra-thick epitaxy

The resulting buried-regrown-implant-structure (BRIS) lasers with 100 μm stripes and lasing wavelength of 915 nm show high efficiency (peak of 67%, 55% at 20 W) and high lateral brightness (3.3

Buried Heterostructure Photonic Crystal Lasers

The buried heterostructure photonic crystal lasers on Si platform promise exciting opportunities in the future for novel device design demonstrations as well as for photonic integrated circuits applications.

Buried heterostructure laser diodes using directly bonded InP thin film

Successful lasing of buried heterostructure GaInAsP SCH MQW laser diode on silicon substrate has been achieved. BH laser structure was obtained by wet etching a.

Lecture 21

By convention, when the distributed reflectors are within the active laser cavity the laser is called a DFB laser and when they are outside the active region on either end of the device the laser is called a

US20100190283A1

Method to form semiconductor laser diode with mesa structure buried by current blocking layer Download PDF

US4731791A

A buried hetero-structure laser diode is disclosed. The buried hetero-structure is formed by growing a double hetero-structure on a substrate. The double hetero-structure comprises two cladding layers

High-efficiency and high-brightness broad area laserdiodes with buried

Buried-regrown-implant-structure (BRIS) technology combines two-step epitaxial regrowth with an intermediate ion implantation step in order to realise a buried current aperture close

1.3-μm InGaAsP planar buried heterostructure laser diodes with AlInAs

This study reports on the realization of 1.3-μm InGaAsP buried-heterostructure (BH) laser diodes (LDs) via an Fe-doped semi-insulating InP layer and a

People also like:

Get In Touch

Connect With Us

📱

Poland (Sales & Engineering HQ)

+48 22 538 72 19

🇪🇺

Germany (EU Technical Support)

+49 30 983 21 44

📍

Headquarters & Manufacturing

ul. Postępu 14, 02-676 Warszawa, Poland